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History of BGA Technology Development
The packaging technology of chips has undergone several generations of changes, from DIP, QFP, PGA, BGA to CSP and then to MCM, with increasingly advanced technical indicators from generation to generation
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Exploration of BGA Packaging Forms
For each BGA, its process parameters can be optimized separately to obtain the optimal thermal response expected when using each form.
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Introduction to BGA Packaging and Welding Technology
The packaging structure of BGA devices can be divided into two types based on the shape of solder joints: spherical solder joints and columnar solder joints. Spherical solder joints are divided into ceramic ball grid arrays according to the packaging material
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The results of the internal analysis of the chip indicate that the failure of BGA is due to local interlayer breakdown phenomenon inside the chip
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Analysis of solder joint voids in BGA, QFN, CSP devices
In SMT production, pinless components such as BGA, QFN, CSP, etc. are inevitably prone to void (bubble) phenomena during soldering, whether it is reflow soldering or wave soldering, whether it is lead or lead-free processes, after cooling.
Dinghua Technology successfully passed the certification of intellectual property management system
He is a worker and a member of the Dinghua family; Enjoy the happiness that work brings to oneself every day, and reunite with family warmly after work. However, the despicable cancer invaded the bodies of his family and shattered his once happy life
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