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History of BGA Technology Development

The packaging technology of chips has undergone several generations of changes, from DIP, QFP, PGA, BGA to CSP and then to MCM, with increasingly advanced technical indicators from generation to generation

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Exploration of BGA Packaging Forms

For each BGA, its process parameters can be optimized separately to obtain the optimal thermal response expected when using each form.

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Introduction to BGA Packaging and Welding Technology

The packaging structure of BGA devices can be divided into two types based on the shape of solder joints: spherical solder joints and columnar solder joints. Spherical solder joints are divided into ceramic ball grid arrays according to the packaging material

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The results of the internal analysis of the chip indicate that the failure of BGA is due to local interlayer breakdown phenomenon inside the chip

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