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Analysis of solder joint voids in BGA, QFN, CSP devices

Analysis of solder joint voids in BGA, QFN, CSP devices

In SMT production, pinless components such as BGA, QFN, CSP, etc. are inevitably prone to void (bubble) phenomena during soldering, whether it is reflow soldering or wave soldering, whether it is lead or lead-free processes, after cooling.

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