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Introduction to BGA Packaging and Welding Technology


The packaging structure of BGA devices can be divided into two types based on the shape of solder joints: spherical solder joints and columnar solder joints. Spherical solder joints are divided into ceramic ball grid arrays according to the packaging material

Introduction and advantages of Dinghua Technology DH-A2E BGA rework station


Dinghua Technology is a domestic high-tech enterprise that integrates research and development, production, sales, and service! We are a professional provider of system solutions and equipment, including BGA repair stations, repair stations, BGA soldering stations, BGA disassembly stations, X-RAY testing equipment, X-RAY marking machines, X-RAY non-destructive testing equipment, chip repair stations, automatic soldering machines, automatic screw locking machines, automatic dispensing machines, etc!