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Exploration of BGA Packaging Forms

For each BGA, its process parameters can be optimized separately to obtain the optimal thermal response expected when using each form.

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Introduction to BGA Packaging and Welding Technology

The packaging structure of BGA devices can be divided into two types based on the shape of solder joints: spherical solder joints and columnar solder joints. Spherical solder joints are divided into ceramic ball grid arrays according to the packaging material

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