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Exploration of BGA Packaging Forms
2024-05-07
Due to its many advantages, BGA has been widely used in the current electronics industry. There are various packaging forms of BGA, forming a "family", and the differences between them mainly lie in the materials and structures (plastic, ceramic, wire bonding, carrier tape, etc.). This article will discuss the impact of this packaging form on the reflow soldering process. All BGAs, regardless of their type, utilize solder terminals - solder balls located at the bottom of their packaging. During reflow soldering, under the action of enormous thermal energy, the ball melts and forms a connection with the solder pads on the substrate. Therefore, the BGA packaging material and its position in the packaging will inevitably affect the heating of the solder balls. In some cases, even a small amount or even individual solder balls cannot be ignored. To verify this inference, we conducted heating tests on typical BGAs of different materials using a structurally simple, single heating direction heat source. In addition, various heating curve tests were conducted on different BGA packages. As a standard reference, each package is tested on a substrate with standard PLCC and SMC using the same process parameters. The temperature curves obtained from these experiments can directly compare the heating characteristics of different packaging forms of BGA. Based on these results, the process parameters of each BGA can be optimized separately to obtain the optimal thermal response expected when using each form.
Keywords：
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exploration
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