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Introduction to BGA Packaging and Welding Technology
2024-02-20
BGA packaging and soldering technology:
The packaging structure of BGA devices can be divided into two types based on the shape of solder joints: spherical solder joints and columnar solder joints. Spherical solder joints are divided into ceramic ball grid arrays according to the packaging material
CBGA (Ceramic Bal l Grid Array), Tape Automatec Ball Grid Array (TBGA), Plastic Ball Grid Array (PBGA). Columnar solder joints are also known as Ceramic Column Grid Array (CCGA) in packaging form.
BGA packaging technology uses circular or columnar solder joints hidden under the packaging body, characterized by large lead spacing and short lead length. During the assembly process, its advantage is that it eliminates the problems of poor coplanarity and warpage caused by leads in fine pitch devices (such as QFPs with a spacing of less than 0.5). The disadvantage is that the multi I/0 end of BGA is located below the package, and the quality of its soldering cannot be judged by the shape of visible solder joints. Even with expensive specialized testing equipment on the market, the soldering quality of BGA cannot be quantitatively judged. Therefore, in the assembly process of BGA, the welding quality is difficult to control due to the invisible factors of solder joints. A comprehensive understanding of the quality influencing factors of BGA soldering technology and targeted control during the production process can effectively improve the soldering quality of BGA chips and ensure the reliability and stability of communication products.
Keywords：
Blog
introduction
bga
packaging
welding
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