Introduction to BGA Packaging and Welding Technology

Introduction to BGA Packaging and Welding Technology

2024-02-20

The packaging structure of BGA devices can be divided into two types based on the shape of solder joints: spherical solder joints and columnar solder joints. Spherical solder joints are divided into ceramic ball grid arrays according to the packaging material
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Analysis of solder joint voids in BGA, QFN, CSP devices

Analysis of solder joint voids in BGA, QFN, CSP devices

2023-11-23

In SMT production, pinless components such as BGA, QFN, CSP, etc. are inevitably prone to void (bubble) phenomena during soldering, whether it is reflow soldering or wave soldering, whether it is lead or lead-free processes, after cooling.
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