Congratulations to Dinghua Technology for winning the "Shenzhen Advanced Manufacturing Intelligent Equipment Field Rooster Award"

2022-01-10

On the evening of December 28, 2021, the Shenzhen Electronic Equipment Industry Association and the Shenzhen Intelligent Equipment Industry Association held an award ceremony and commendation conference at the Shenzhen International Convention and Exhibition Center
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Dinghua Technology was awarded the honorary title of "Lixin Enterprise" by Shuidi Credit

2021-11-12

On November 10, 2020, Dinghua Technology Development Co., Ltd. passed the enterprise credit evaluation certification and was awarded the title of "Lixin Enterprise" by Shuidi Credit. This honor is not only a recognition of Dinghua Technology's comprehensive strength, but also a witness to its honest management.
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The most attractive basic characteristics of BGA

2021-06-12

The most notable basic feature of BGA is that it can still utilize existing SMT processes for IO quantities exceeding 200. The most basic component of SMT is reflow soldering, and existing reflow soldering furnaces have been proven to be suitable for soldering highly reliable BGA packages.
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