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The most attractive basic characteristics of BGA
2021-06-12
As is well known, BGA is rapidly becoming one of the most common ways for integrated circuits (ICs) to interconnect with printed boards. The most notable basic feature of BGA is that it can still utilize existing SMT processes for IO quantities exceeding 200. The most basic component of SMT is reflow soldering, and existing reflow soldering furnaces have been proven to be suitable for soldering highly reliable BGA packages. Although the time temperature curve of BGA soldering is the same as the standard curve, it is still necessary to understand the special properties of these packages when using them. This is particularly important because unlike most traditional SMT devices, the solder joints of BGA are located below the device between the device body and the PCB. Therefore, the influence of internal materials in the structure on the contacts is much greater than that of most traditional packaging forms. Because the leads in traditional packaging form are arranged around the device body, at least partially exposed to the heating environment.
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