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Analysis of solder joint voids in BGA, QFN, CSP devices

2023-11-23

In SMT production, pinless components such as BGA, QFN, CSP, etc. are inevitably prone to void (bubble) phenomena during soldering, whether it is reflow soldering or wave soldering, whether it is lead or lead-free processes, after cooling.

Introduction and advantages of Dinghua Technology DH-A2E BGA rework station

2022-07-28

Dinghua Technology is a domestic high-tech enterprise that integrates research and development, production, sales, and service! We are a professional provider of system solutions and equipment, including BGA repair stations, repair stations, BGA soldering stations, BGA disassembly stations, X-RAY testing equipment, X-RAY marking machines, X-RAY non-destructive testing equipment, chip repair stations, automatic soldering machines, automatic screw locking machines, automatic dispensing machines, etc!

Dinghua Technology successfully passed the certification of intellectual property management system

2022-04-27

He is a worker and a member of the Dinghua family; Enjoy the happiness that work brings to oneself every day, and reunite with family warmly after work. However, the despicable cancer invaded the bodies of his family and shattered his once happy life

Congratulations to Dinghua Technology for winning the "Shenzhen Advanced Manufacturing Intelligent Equipment Field Rooster Award"

2022-01-10

On the evening of December 28, 2021, the Shenzhen Electronic Equipment Industry Association and the Shenzhen Intelligent Equipment Industry Association held an award ceremony and commendation conference at the Shenzhen International Convention and Exhibition Center

Dinghua Technology was awarded the honorary title of "Lixin Enterprise" by Shuidi Credit

2021-11-12

On November 10, 2020, Dinghua Technology Development Co., Ltd. passed the enterprise credit evaluation certification and was awarded the title of "Lixin Enterprise" by Shuidi Credit. This honor is not only a recognition of Dinghua Technology's comprehensive strength, but also a witness to its honest management.

The most attractive basic characteristics of BGA

2021-06-12

The most notable basic feature of BGA is that it can still utilize existing SMT processes for IO quantities exceeding 200. The most basic component of SMT is reflow soldering, and existing reflow soldering furnaces have been proven to be suitable for soldering highly reliable BGA packages.

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Hot Products

DHKC-S600 Xray counter machine

DH-X7 PCB Xray inspection machine

DH-X9 X-Ray PCB inspection

DH-A2E Automatic BGA rework station

DH-A5 automatic BGA rework machine

DH-A6 Automatic BGA rework station

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> Tel: +8615768114827 /+86-755-29091822
> Fax: +86-0755-29091622
> Email: John@dh-kc.com
> Address: 4th Floor, Building 6B, Shengzuozhi Technology Park, Xinqiao(518125),Bao'an,Shenzhen, Guangdong, China.

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