Manual BGA rework station

Dinghua DH-5830 BGA Rework Station

This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.

Product  Application
 

Motherboard of computer,smartphone,laptop,digital camera ,air conditioner,TV and other electronic equipments from medical industry,communication industry,automobile industry,etc.

Wide range of application: BGA, PGA, POP,BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.

Main Features

1. Nozzle with Reflow Vent

1) All the Nozzles are made by Titanium Alloy.

2) Top Nozzle has Reflow Vent to prevent the damage to surrounding components.

3) Magnetic Nozzle, Easy to install / adjust / change.

 

2. Cooling Fan

1) Cross air flow to cool  the PCB after heating, it is important for prevent deformation

2) Auto Cooling after the heating complete.

 

3. LED Light

A high Power LED light with flexible tube will give you a bright rework,  you can effectively see the melting of tin or mold on small components.

 

4. Top Air Flow Adjust Button

With top air speed adjustable function, prevent small bga chip from moving flow by strong air.

 

 

 

Manual BGA rework station:For the critical reballing process, the manual station includes a complete stencil kit with aluminum frames holding precision-etched stainless steel templates for common BGA pitch sizes. The solder ball placement jig features micrometer-adjustable guides to ensure accurate alignment over the component, with magnetic fixation holding the stencil securely during ball distribution. A specially designed solder ball dispenser bottle with fine-tip applicator allows controlled placement of replacement spheres, while a static-safe brush assists in final distribution across the array pattern. The station stores all these accessories in dedicated compartments with foam inserts, keeping tools organized and protected between uses.

Process control relies on the technician's skill augmented by the station's measurement tools. A handheld infrared thermometer with laser targeting provides spot temperature readings of components and board areas, while a built-in digital timer helps track critical phases of the rework process. The station includes various nozzle sizes for the rework tool to accommodate different component dimensions, with color-coded collars indicating temperature ranges for quick visual reference during operation. A flip-up soldering iron holder positions a precision temperature-controlled iron ready for touch-up work, completing the thermal toolset for comprehensive BGA rework capability.

The physical construction emphasizes durability and workspace efficiency, with a heavy-gauge steel frame supporting a high-temperature work surface resistant to flux and solder splatter. The integrated fume extraction arm adjusts to multiple positions, capturing vapors directly at the work point without interfering with tool access. Tool hangers and accessory racks keep all implements within easy reach, while the non-slip rubber matting prevents component movement during delicate operations. The entire station occupies a compact footprint suitable for bench-top use, with all electrical components featuring ESD-safe grounding for sensitive electronic work.

Operator safety receives careful consideration in the design, with silicone-insulated tool handles protecting against accidental burns and the hot air tool's auto-cooling function preventing heat buildup when idle. The fume extraction system incorporates replaceable activated carbon filters to remove harmful flux vapors, while the preheater plate includes over-temperature protection that automatically cycles power if unsafe conditions develop. Bright LED task lighting illuminates the work area without creating glare or shadows that could interfere with visual alignment tasks.