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BGA Reballing Station
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Sencils matched:80*80mm,90*90mm Material: Aluminum alloy Ball Grid Array (BGA) technology has become a cornerstone in modern electronics manufacturing. BGAs are widely used in various devices such as computers, smartphones, and gaming consoles due to their high - density packaging capabilities. However, when BGAs encounter issues such as solder joint failure, a BGA reballing station comes into play for repair and refurbishment.
The reballing station then prepares new solder balls. These solder balls are precisely sized and made of a high - quality solder alloy to ensure proper electrical conductivity and mechanical stability. The station positions the new solder balls onto the BGA pads with high accuracy. This accuracy is vital because misaligned solder balls can lead to improper connections and subsequent device failure.
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