How to Drastically Reduce Voids in BGA Soldering Using X-ray Inspection

2026-09-23

Among all assembly defects, BGA soldering voids are the most critical threat to electronic product reliability. In this article, we’ll explore how industrial X-ray inspection machines can help you detect, calculate, and eliminate these hidden defects to safeguard your product quality.
How to Drastically Reduce Voids in BGA Soldering Using X-ray Inspection
In modern surface mount technology (SMT) and PCB assembly, Ball Grid Array (BGA) packaging has become the standard for high-density microprocessors and memory chips. However, because BGA solder joints are hidden entirely underneath the component body, traditional automated optical inspection (AOI) systems are completely blind to what happens beneath the chip.
Among all assembly defects, BGA soldering voids are the most critical threat to electronic product reliability. In this article, we’ll explore how industrial X-ray inspection machines can help you detect, calculate, and eliminate these hidden defects to safeguard your product quality.
 
 
The Hidden Danger of BGA Soldering Voids
Voids are empty spaces or air bubbles trapped within a solder joint. They are typically caused by volatile outgassing from flux pastes during the reflow process, improper PCB pad preparation, or poorly optimized temperature profiles.
While a minor percentage of voiding is acceptable under IPC-A-610 standards (usually less than 25% of the total solder ball area), excessive voiding causes severe issues:
  • Reduced Mechanical Strength: Makes the solder joints susceptible to cracking under vibration or drop tests.
  • Poor Thermal Conductivity: Traps heat inside the BGA, leading to localized overheating and premature chip failure.
  • Intermittent Electrical Failures: Causes signal degradation or complete open circuits over time.
 
 
How X-ray Inspection Eliminates the Blind Spot
An industrial PCB X-ray inspection machine uses high-energy X-ray beams to penetrate the low-density materials of the electronics (like plastic and FR4 fiberglass) while being absorbed by high-density materials (like lead and tin in solder).
 
[ X-ray Source ] ──► [ PCB / BGA Chip ] ──► [ Digital Image Detector ]
                           │                        │
                    (Low Density Area)       (High Density Solder)
                           ▼                        ▼
                     Appears Lighter          Appears Darker (Voids show as light spots)
By generating a high-contrast digital radiograph, SMT quality control engineers can instantly look inside the solder sphere. On an X-ray image, a healthy solder ball appears as a uniform dark circle, while voids appear as bright, distinctive white spots inside that circle.
 
 
Step-by-Step: Utilizing X-ray to Optimize Your SMT Process
  1. Automated Void Area Calculation (AXI): Modern X-ray systems, such as the Dinghua DH-X7, feature intelligent software that automatically identifies every single BGA solder ball and calculates the exact void percentage instantly.
  2. Reflow Profile Fine-Tuning: If your X-ray inspection logs show consistent voiding across a specific batch, it is a clear indicator to adjust your reflow oven’s soak zone time and peak temperatures to allow gases to escape safely before the solder solidifies.
  3. Synergy with Rework Equipment: When the X-ray machine flags a board with critical voiding, it can be routed directly to an automatic BGA rework station for safe desoldering, re-balling, and precise re-mounting without scrapping the entire PCB assembly.
 
 
Protect Your Brand Reputation with Advanced Quality Control
Visual inspection is no longer enough for high-reliability electronics in automotive, aerospace, or industrial automation sectors. Implementing an offline or online X-ray machine on your shop floor is the ultimate proof of quality to your overseas buyers.
 
Are you struggling with hidden BGA soldering defects or failing quality audits?

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