Professional Equipment Manufacturer
Esperanto
Shqiptare
Euskara
Zulu
Latinus
Cymraeg
தமிழ்
Slovak
Slovak
Afrikaans
High-Precision Chip-Level Repair Solution for Advanced Electronics Manufacturing
2026-09-23
- Precision Control: Achieves mounting accuracy up to ±0.01mm.
- Visual Clarity: Clearly displays the overlapping images of the BGA chip pads and PCB footprints on a high-resolution monitor.
- Top & Bottom Hot Air: Precision nozzles deliver targeted hot air to the component, mimicking factory reflow profiles.
- Bottom IR Preheating: A massive carbon fiber infrared matrix evenly preheats the entire board to reduce thermal stress on multi-layer PCBs.
- Smart Profiles: Save and password-protect up to 50,000 groups of 6-stage temperature curves.
- Automatic Pick & Place: The integrated vacuum pickup automated mechanism automatically lifts the chip after reflow and places it precisely during mounting.
- Safety First: Built-in airflow protection, emergency stop, and real-time sensor monitoring ensure both operator and equipment safety.
| Feature / Specs | DH-A6 Specifications | Key Advantages |
|---|---|---|
Total Power | Max 5300W | High-power output for lead-free soldering |
Mounting Accuracy | ±0.01 mm | Ideal for fine-pitch QFN, BGA, POP chips |
PCB Dimension | Min 2020 mm to Max 410370 mm | Versatile enough for smartphones to servers |
Temperature Control | K-type Thermocouple (Closed-Loop) | Precise temperature curve within ±1°C |
Keywords：
Related News
2026 Complete Guide: What Is Nondestructive Testing Equipment & How to Choose
This comprehensive guide for 2026 covers core knowledge about Nondestructive Testing Equipment, including definitions, common types, key selection criteria, industry applications, and answers to frequently asked questions. Drawing from over 10 years of manufacturing X-ray NDT equipment for electronics manufacturing, we share real testing data and industry insights to help you make informed purchasing decisions.
How to Drastically Reduce Voids in BGA Soldering Using X-ray Inspection
Among all assembly defects, BGA soldering voids are the most critical threat to electronic product reliability. In this article, we’ll explore how industrial X-ray inspection machines can help you detect, calculate, and eliminate these hidden defects to safeguard your product quality.
High-Precision Chip-Level Repair Solution for Advanced Electronics Manufacturing
The DH-A6 Automatic BGA Rework Station is Dinghua’s flagship industrial-grade solution designed for high-yield, high-precision desoldering, mounting, and soldering of various SMT components. Whether you are reworking heavy multi-layer PCBs, server motherboards, automotive electronics, or miniature smartphone chips, the DH-A6 delivers unmatched thermal stability and alignment accuracy to eliminate human error and boost your production line's ROI.
2026 Industrial X-Ray Machine Buying Guide: 7 Core Factors to Save Cost & Avoid Mistakes
This Industrial X-Ray Machine Buying Guide is tailored for procurement teams, NDT technicians, and production managers planning to purchase industrial x-ray inspection equipment in 2026. Drawing on 12 years of hands-on manufacturing and testing experience from Dinghua Technology, a leading supplier of BGA rework stations and industrial x-ray machines, this guide covers core selection steps, performance comparisons, and answers to common questions to simplify your buying journey.
Contact Us
> Tel: +8615768114827 /+86-755-29091822
> Fax: +86-0755-29091622
> Email: John@dh-kc.com
> Address: 4th Floor, Building 6B, Shengzuozhi Technology Park, Xinqiao(518125),Bao'an,Shenzhen, Guangdong, China.
Copyright © 2024 Shenzhen Dinghua Innovation Technology Co., Ltd. All Rights Reserved.