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High-Precision Chip-Level Repair Solution for Advanced Electronics Manufacturing
2026-09-23
- Precision Control: Achieves mounting accuracy up to ±0.01mm.
- Visual Clarity: Clearly displays the overlapping images of the BGA chip pads and PCB footprints on a high-resolution monitor.
- Top & Bottom Hot Air: Precision nozzles deliver targeted hot air to the component, mimicking factory reflow profiles.
- Bottom IR Preheating: A massive carbon fiber infrared matrix evenly preheats the entire board to reduce thermal stress on multi-layer PCBs.
- Smart Profiles: Save and password-protect up to 50,000 groups of 6-stage temperature curves.
- Automatic Pick & Place: The integrated vacuum pickup automated mechanism automatically lifts the chip after reflow and places it precisely during mounting.
- Safety First: Built-in airflow protection, emergency stop, and real-time sensor monitoring ensure both operator and equipment safety.
| Feature / Specs | DH-A6 Specifications | Key Advantages |
|---|---|---|
Total Power | Max 5300W | High-power output for lead-free soldering |
Mounting Accuracy | ±0.01 mm | Ideal for fine-pitch QFN, BGA, POP chips |
PCB Dimension | Min 2020 mm to Max 410370 mm | Versatile enough for smartphones to servers |
Temperature Control | K-type Thermocouple (Closed-Loop) | Precise temperature curve within ±1°C |
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Contact Us
> Tel: +8615768114827 /+86-755-29091822
> Fax: +86-0755-29091622
> Email: John@dh-kc.com
> Address: 4th Floor, Building 6B, Shengzuozhi Technology Park, Xinqiao(518125),Bao'an,Shenzhen, Guangdong, China.
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