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How to Inspect PCB Solder Joints Using an Industrial X-Ray Machine
2026-09-07
How to Inspect PCB Solder Joints Using an Industrial X-Ray Machine
In modern electronics manufacturing, components are getting smaller, denser, and more complex. Hidden solder joints—such as those under BGA (Ball Grid Array), QFN, and CSP packages—cannot be inspected with traditional visual AOI (Automated Optical Inspection) systems.
This is where industrial X-ray inspection machines become indispensable. Non-destructive testing (NDT) via X-ray allows quality control teams to see right through the components and board layers.
What Can an X-Ray Machine Detect in PCB Solder Joints?
High-resolution X-ray systems can reveal microscopic internal defects that cause device failure:
Solder Voids: Air bubbles trapped inside solder joints, which can drastically reduce thermal and electrical conductivity.
Bridging / Short Circuits: Excess solder connecting adjacent pads that are invisible from the exterior.
Insufficient Solder / Open Circuits: Poor wetting or misalignment preventing proper connection.
Key Factors When Choosing a PCB X-Ray Machine
When selecting an X-ray unit for your production line (such as the DH-X7 or DH-X9 series from Dinghua), pay attention to:
Tube Voltage and Power: Determines penetration capability across different board thicknesses and multi-layer PCBs.
Detector Resolution: Higher resolution ensures crisp, clear images of micro-defects.
Caliper and Measurement Tools: Software capabilities for automatically calculating void percentages against IPC standards.
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