DH-5830 BGA SMD Mobil Phone Desoldering Soldering Infraroud BGA Rework Statione
Dës Masjin ass fir de Motherboard IC/Chip/Chipset vun Laptop, Mobile, PC, iPhone, Xbox, etc. mat Featuren 3-heater (2xHot Air IR Preheating), embettt Smart PC, Autoprofil, Cooling Fan, Micro-Hot-air-Austrung, Vacuum Pick-up & Place, Universal Support fir meich vun der PCB Gréisst/Shape.
méi gewuer ginn